Publications
2009 | 2008 | 2007 | 2006 | 2005 | 2004 | 2003
1. T. Reinikainen and E. Suhir, "Shear test methodology for the most accurate assessment of solder material properties", Proceedings of the 59th Electronic Components and Technology Conference, San Diego, California, USA, May 26-29, 2009.
2. E. F. Monlevade and T. Reinikainen, " Grain growth behavior of commercially pure tin - A route for obtaining single or oligocrystalline samples for mechanical tests", Proceedings of the 59th Electronic Components and Technology Conference, San Diego, California, USA, May 26-29, 2009.
2008
3. O. C. Silva, S. Dacol, R. Queiroz, and W. V. Machado, "O consumo energético para o transporte de produtos da Amazônia: uma visão focada no desenvolvimento sustentável," in N. Barreiros and W. V. Machado, Reflexões Sobre Desenvolvimento, Transporte e Logística na Amazônia Brasileira, Manaus, UFAM, IN PRESS.
4. L. Arruda, R. Bonadiman, J. Costa, and T. Reinikainen, "Cracking phenomena on flexible-rigid interfaces in PWBs under thermo cycling loading", The Proceeding of the 10th Electronics Packaging Technology Conference - EPTC2008, Singapore, Singapore, December 09-12, 2008, IEEE.
5. R. Bonadiman, M. E. Marques, G. Freitas and T. Reinikainen, "Evaluation of printing parameters and substrate treatment over the quality of printed silver traces", The Proceeding of the 2nd Electronics System-Integration Technology Conference - ESTC 2008, Greenwich, London, UK, September 1 - 4, 2008, IEEE.
6. O. C. Silva and D. S. Blanco. "Study on the degradability of synthetic and bio-based polymers," The Proceedings of the 14th International Conference on Thermal Analysis and Calorimetry and 6th Brazilian Conference on Thermal Analysis and Calorimetry, São Pedro/SP, Brazil, September 14 - 18, 2008, ICTAC.
7. E. Suhir and T. Reinikainen, "On a paradoxical situation related to lap-shear joints; could transverse grooves in the adherents reduce the interfacial stresses", Journal of Physics D: Applied Physics, 41, 11, (2008) 115505
8. J. M. S. Neto and C. Pagliosa, "Comparison of prony series and generalized derivative model in polymeric material modeling," Proceedings of the V National Congress of Mechanical Engineering, Salvador, Brazil, August 25 - 28, 2008, ABCM, (2008).
9. O. C. Silva, A. H. C. Sena, and R. E. S. Lisboa. "A study on implementation on innovation management in an emergent research centre," The Proceeding of the XIX Conference of the International Society for Professional Innovation Management, Tours, France, June 14 - 19, 2008, ISPIM.
10. R. Bonadiman, O. C. Silva, D. S. Blanco, J. O. Souza, B. Siqueira, and H. A. Cauper, "Comparative degradation level analysis of bio-based and synthetic materials when submitted to different environmental conditions", The Proceedings of the Polymer Processing Society 24th Annual Meeting PPS-24, Salerno, Italy, June 15-19, 2008.
11. O. C. Silva, R. Bonadiman, B. G. Siqueira, J. S. Oliveira, and H. A. A. Cauper, "Mechanical properties comparison of bio-based and synthetic materials when submitted to different environmental conditions," The Proceedings of the Annual Technical Conference of the Society of Plastics Engineers, Milwaukee, USA, May 4 - 8, (2008), SPE/ANTEC.
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2007
12. W. Peng, E. F. Monlevade, and M. E. Marques, "Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu," Microelectronics Reliability, 47, 12, (2007), pp. 2161-2168.
13. W. Peng, and M. E. Marques, "Effect of thermal aging on drop performance of chip scale packages with Cu/SnAgCu solder joints on Cu pads", Journal of Electronic Materials, 36, 12, (2007), pp. 1679-1690.
14. E. F. Monlevade and W. Peng, "Failure mechanisms and crack propagation paths in thermally aged Pb-free solder interconnects", Journal of Electronic Materials, 36, (2007), pp. 783-797.
15. M. E. Marques, R. Bonadiman, G. G. Freitas, and T. Reinikainen, "Evaluation of inkjet printing parameters in the quality of printable electronics," The Proceedings of ISFlexED Conference, Hsinchu, Taiwan, December 17-18, 2007, Industrial Technical Research Institute, pp. 144-145.
16. L. Arruda, G. Freitas, "Drop test and squeeze film simulation of flexible circuits boards", The Proceeding of the 2007 SOFTEC ANSYS Conference, Rio de Janeiro, Brasil, October 26-30, 2007, SOFTEC, pp. 13-16.
17. O. C. Silva, D. C. Rolim, and R. Bonadiman, "Pad battery corrosion influence of gold coating thickness", The Proceedings of the 21st Conference of Brazilian Society of Microscopy and Microanalysis, Búzios, Brazil, August 26 - 29, 2007, CSBMM.
18. O. C. Silva and S. Dacol, "Logistical chains in the Amazon: environmental impact focused on energy consumption," The proceedings of the 19th International Conference on Production Research, Valparaiso, Chile, July 29 - August 2, 2007, ICPR.
19. L. Arruda, "On the simulation of flexible circuit boards", The Proceeding of the 16th European Microelectronics and Packaging Conference & Exhibition - EMPC2007, Oulu, Finland, June 17-20, 2007, IMAPS, pp. 136-139.
20. O. C. Silva, "Synthetic vs. biometerials: an overview focused on energy consumption", The Proceedings of 23rd Annual Meeting of the Polymer Processing Society, Salvador, Brazil, May 27 - 31, 2007.
21. J. Varghese, G. Sobue, D. Farley, G. Freitas, and A. Dasgupta, "Guidelines for transient modeling of board level drop tests", Proceedings of the NAFEMS World Congress, Vancouver, Canada, May 22-25, 2007, NAFEMS.
22. L. Arruda, G. Freitas, "Effect of surrounding air on board level drop tests of flexible printed circuit boards" The Proceedings of the 8th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-System - EUROSIME 2007. London, England, April 26-28, 2007, IEEE, (2007), pp. 476-479.
23. R. Bonadiman, O. C. Silva, G. Sobue, and I. A. P. Cardoso, "Mechanical behavior of aged pressure sensitive adhesive", The Proceedings of the XI International macromolecular Colloquium and 6th International Symposium on Natural Polymers and Composites, Gramado, Brazil, April 22 - 25, 2007, IMC/ISNAPOL.
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24. A. Gupta, Y. Ding, L. Xu, and T. Reinikainen, "Optimal parameter selection for electronic packaging using sequential computer simulations", ASME Journal of Manufacturing Science and Engineering, 128, 3, (2006), pp. 705-715.
25. M. E. Marques, E. F. Monlevade, and W. Peng, "Effect of thermal aging on electrical resistance of SnAgCu/Cu joints", The Proceedings of the 39th International Symposium on Microelectronics, San Diego, USA, October 8 - 12, 2006, International Microelectronics and Packaging Society, pp. 120-126.
26. D. C. Rolim, E. F. Monlevade, and O. C. Silva, "Solidification structures of Sn-Cu and Sn-Ag-Cu alloys after furnace cooling", Proceedings of the 5th Brazilian Materials Research Society Meeting, Florianópolis, Brazil, October 8-12, 2006.
27. D. C. Rolim, E. F. Monlevade, and O. C. Silva. "Solidification structures of Sn-Cu and Sn-Ag-Cu alloys after air cooling", Proceedings of the 5th Brazilian Materials Research Society Meeting, Florianópolis, Brazil, October 8-12, 2006.
28. J. D. T. Capocchi, E. F. Monlevade, E. T. Kubaski, C.Moinhos, and O. M. Cintho, "Homogenization evaluation of Fe-19.5Cr-5Ni mechanical alloyed mixture using EDS compositional linescan", Proceedings of the 5th Brazilian Materials Research Society Meeting, Florianópolis, Brazil, October 8-12, 2006.
29. L. J. Ladani, A. Dasgupta, I. A. P. Cardoso, and E. F. Monlevade, "Effects of selected manufacturing parameters on reliability of Lead free solder joints", Proceedings of the ASME International Mechanical Engineering Congress, November 5-10, Chicago, Illinois, USA, 2006.
30. G. Myrria, G. Sobue, and A.W. Oliveira, "Printed circuit board model definition using continuum shell", Proceedings of the 4th Abaqus Latin American Users Meeting, São Paulo, Brazil, August 30-31, 2006, Smarttech.
31. E. F. Monlevade and T. Reinikainen, "Fracture surface analysis of aged and drop tested Sn-Ag-Cu solder joints", Proceedings of the 8th International Conference on High Density Microsystem Design, Packaging and Component Failure Analysis, Shanghai, China, June 27-30, 2006, IEEE/CPMT.
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2005
32. T. Reinikainen, P. Marjamäki, and J.K. Kivilahti, "Deformation characteristics and microstructure evolution of SnAgCu solder joints", Proceedings of the 6th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, April 18-20, 2005, IEEE, pp. 91 - 98.
33. J. Zhu., K. Ishibashi, and T. Reinikainen, "Reliability study of package stacking under thermo-mechanical conditions", Proceedings of the ASME International Mechanical Engineering Congress, Orlando, Florida, USA, November 5-11, 2005, ASME.
34. H.S. Ng, T.Y. Tee, K. Y. Goh, J. Luan, T. Reinikainen, E. Hussa, A. Kujala, "Absolute and relative life-prediction methodology for virtual qualification and design enhancement of lead-free BGAs", Proceedings of the 55th Electronic Components and Technology Conference, Orlando, Florida, USA, May 31-June 3, 2005, IEEE/CPMT, pp.1282-1291.
35. Z. Han, L. Xu, B. Wang, and T. Reinikainen, "A novel response surface method for simulation-based design optimizations of electronic packages", Proceedings of the 6th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, Berlin, Germany, April 18-20, 2005, IEEE/CPMT.
36. J. Luan, T.Y. Tee, K. Y. Koh, H. S. Ng, X. Baraton, R. Bronner, M. Sorrieul, E. Hussa, T. Reinikainen, A. Kujala, "Drop impact life prediction for lead-free BGA packages and modules", Proceedings of the 6th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE, Berlin, Germany, April 18-20, 2005, IEEE/CPMT, pp. 559 - 565.
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2004
37. L. Xu, T. Reinikainen, W. Ren, B. Wang, Z. Han, and D. Agonafer, "A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending", Microelectronics Reliability, 44, 12, (2004), pp. 1977 - 1983.
38. W. Ren, J. Wang, and T. Reinikainen, "Application of ABAQUS/Explicit submodeling technique in drop simulation of system assembly", Proceedings of the 6th Electronic Packaging Technology Conference, Singapore, 8-10 December, 2004, IEEE, pp. 541-546.
39. Z. Han, L. Xu, W. Ren, B. Wang, and T. Reinikainen, "Reliability-based optimization for land grid array solder joints under thermo-mechanical load", Proceedings of the 5th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, Brussels, Belgium, May 10-12, 2004, pp. 219-224.
40. M. Hossain, D. Agonafer, V. Puligandla, and T. Reinikainen, "Strain based approach for predicting the solder joint fatigue life with the addition of intermetallic compound using the finite-element method", Proceedings of the 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ITHERM, Las Vegas, Nevada, USA, June 1-4, 2004, IEEE/CPMT, pp. 358 - 367.
41. S. Canumalla, H.-D. Yang, V. Puligandla, and T. Reinikainen, "Package to board interconnection shear strength (PBISS): Effect of surface finish, PWB build-up layer and chip scale package structure", IEEE Transactions on Components, Manufacturing, and Packaging Technologies, 27, 1, (2004), pp. 182-190.
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42. L. Xu, W. Ren, T. Reinikainen, Z. Han, B.P. Wang, and D. Agonafer, "Simulation-based multi-objective design optimization of electronic packages under thermal cycling and bend loading", Proceedings of the 4th International Conference on Thermal, Mechanical and Thermo-mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems, Aix-en-Provence, France, April 7-9, 2003.
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